Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020222297 - METHOD OF FABRICATING A THROUGH GLASS VIA ON A SUSPENDED NANOCRYSTALLINE DIAMOND

Publication Number WO/2020/222297
Publication Date 05.11.2020
International Application No. PCT/JP2020/016402
International Filing Date 14.04.2020
IPC
C03C 15/00 2006.1
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
15Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 23/00 2006.1
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
23Other surface treatment of glass not in the form of fibres or filaments
B23K 26/382 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
CPC
B23K 2103/54
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
54Glass
B23K 26/0624
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
0624using ultrashort pulses, i.e. pulses of 1ns or less
B23K 26/082
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/384
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
384of specially shaped holes
B23K 26/386
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
386of blind holes
B23K 26/402
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
402involving non-metallic material, e.g. isolators
Applicants
  • OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION [JP]/[JP]
Inventors
  • JANSSENS Stoffel Dominique
  • VAZQUEZ-CORTES David
  • GIUSSANI Alessandro
  • FRIED Eliot Martin
Agents
  • NISHIDA Takami
Priority Data
62/839,76828.04.2019US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF FABRICATING A THROUGH GLASS VIA ON A SUSPENDED NANOCRYSTALLINE DIAMOND
(FR) PROCÉDÉ DE FABRICATION D'UN TROU D'INTERCONNEXION À TRAVERS LE VERRE SUR UN DIAMANT NANOCRISTALLIN EN SUSPENSION
Abstract
(EN) Low-cost and robust platforms are key for the development of next-generation 3D micro- and nanodevices. To fabricate such platforms, nanocrystalline diamond (NCD) is a highly appealing material due to its biocompatibility, robustness, and mechanical, electrical, electrochemical, and optical properties, while glass substrates with through vias are ideal interposers for 3D integration due to the excellent properties of glass. A low-cost process - free of photolithography and transfer printing - for fabricating arrays of TGVs that are sealed with suspended portions of an ultra-thin NCD film on one side is presented. These highly transparent structures may serve as a platform for the development of microwells for single-cell culture and analysis, 3D integrated devices such as microelectrodes, and quantum technologies. It is also possible to replace the NCD with silicon nitride or silicon carbide, allowing for the development of complex heterogeneous structures on a small scale.
(FR) Des plates-formes économiques et robustes sont essentielles pour le développement de micro- et de nano-dispositifs 3D de prochaine génération. Pour fabriquer de telles plates-formes, le diamant nanocristallin est un matériau hautement attractif en raison de sa biocompatibilité, de sa robustesse et de ses propriétés mécaniques, électriques, électrochimiques et optiques, tandis que les substrats en verre dotés de trous d'interconnexion traversants constituent d'excellents éléments d'interposition pour une intégration 3D en raison des excellentes propriétés du verre. Un procédé peu coûteux, ne faisant appel ni à la photolithographie ni à l'impression par transfert, pour la fabrication de réseaux de trous d'interconnexion à travers le verre (TGV) qui sont scellés avec des parties en suspension d'un film en diamant nano-cristallin ultra-mince sur une face est présenté. Ces structures hautement transparentes peuvent servir de plateforme pour le développement de micro-puits pour la culture et l'analyse de cellules uniques, de dispositifs intégrés 3D, tels que des micro-électrodes, et de technologies quantiques. Il est également possible de remplacer le diamant nano-cristallin par du nitrure de silicium ou du carbure de silicium, ce qui permet le développement de structures hétérogènes complexes à petite échelle.
Related patent documents
KR1020217038656This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
EP2020799073This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
Latest bibliographic data on file with the International Bureau