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1. WO2020029363 - OLED DEVICE AND PREPARATION METHOD THEREFOR

Publication Number WO/2020/029363
Publication Date 13.02.2020
International Application No. PCT/CN2018/104970
International Filing Date 11.09.2018
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 21/77 2017.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
CPC
G06F 2203/04102
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2203Indexing scheme relating to G06F3/00 - G06F3/048
041Indexing scheme relating to G06F3/041 - G06F3/045
04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
G06F 2203/04103
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2203Indexing scheme relating to G06F3/00 - G06F3/048
041Indexing scheme relating to G06F3/041 - G06F3/045
04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
G06F 3/0412
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
0412Digitisers structurally integrated in a display
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 2227/326
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
326Use of temporary substrate, e.g. for manufacturing of OLED dsiplays having an inorganic driving circuit
H01L 2251/5338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
53Structure
5338Flexible OLED
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 王海 WANG, Hai
  • 颜伟男 YAN, Weinan
  • 蔡昆岳 TSAI, Kunyueh
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201810907178.210.08.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OLED DEVICE AND PREPARATION METHOD THEREFOR
(FR) DISPOSITIF À OLED ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种OLED器件及其制备方法
Abstract
(EN)
Provided are an OLED device and a preparation method therefor. The OLED device comprises: a flexible substrate (302), wherein a signal electrode (307) is embedded on the surface of one side of the flexible substrate (302) and a film transistor layer (303) and a pixel cell layer (304) are prepared on the surface of the other side of the flexible substrate (302); both a first drive chip (314) and a flexible circuit board (3016) are arranged on the back of the flexible substrate (302); and signal traces in the film transistor layer (303) and the pixel cell layer (304) are connected with a corresponding signal electrode (307) through via holes (308-311) respectively, and the signal electrode (307) is connected with the first drive chip (314).
(FR)
L'invention concerne un dispositif à OLED et son procédé de préparation. Le dispositif à OLED comprend : un substrat flexible (302), une électrode de signal (307) étant incorporée sur la surface d'un côté du substrat flexible (302) et une couche de transistor à couche (303) et une couche de cellule de pixel (304) sont préparées sur la surface de l'autre côté du substrat flexible (302); à la fois une première puce d'attaque (314) et une carte de circuit imprimé flexible (3016) sont disposées sur l'arrière du substrat flexible (302); et des traces de signal dans la couche de transistor à couche (303) et la couche de cellule de pixel (304) sont connectées à une électrode de signal correspondante (307) par l'intermédiaire de trous d'interconnexion (308-311) respectivement, et l'électrode de signal (307) est connectée à la première puce d'attaque (314).
(ZH)
提供一种OLED器件及其制备方法,包括:柔性基板(302),柔性基板(302)一侧表面嵌设有信号电极(307),另一侧表面制备有薄膜晶体管层(303)与像素单元层(304);第一驱动芯片(314)与柔性电路板(3016)均设置于柔性基板(302)的背面;薄膜晶体管层(303)以及像素单元层(304)中的信号走线分别通过过孔(308-311)与相应的信号电极(307)连接,信号电极(307)与第一驱动芯片(314)连接。
Also published as
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