Processing

Please wait...

Settings

Settings

Goto Application

1. WO2018216627 - ELECTRONIC DEVICE

Publication Number WO/2018/216627
Publication Date 29.11.2018
International Application No. PCT/JP2018/019358
International Filing Date 18.05.2018
IPC
H01L 23/40 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/3677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3677Wire-like or pin-like cooling fins or heat sinks
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H05K 1/0206
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
0206by printed thermal vias
H05K 2201/066
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
066Heatsink mounted on the surface of the PCB
H05K 2201/10734
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10621Components characterised by their electrical contacts
10734Ball grid array [BGA]; Bump grid array
Applicants
  • 株式会社ソニー・インタラクティブエンタテインメント SONY INTERACTIVE ENTERTAINMENT INC. [JP]/[JP]
Inventors
  • 鹿間 和幸 SHIKAMA, Kazuyuki
  • 宇佐美 守央 USAMI, Morio
Agents
  • 特許業務法人はるか国際特許事務所 HARUKA PATENT & TRADEMARK ATTORNEYS
Priority Data
2017-10125722.05.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract
(EN)
According to the present invention, a heat sink (21) is arranged on the lower surface of a circuit board (10). The circuit board (10) has a through hole (h1) that penetrates through the circuit board (10) within a region (A) in which an integrated circuit device (5) is arranged. This through hole (h1) is provided with a heat conduction path (11). The heat conduction path (11) connects the integrated circuit device 5 and the heat sink (21) to each other. Due to this configuration, a component that is different from the heat sink (21) is able to be arranged on the same side as the integrated circuit device (5), and thus the degree of freedom in component layout is able to be increased.
(FR)
Selon la présente invention, un dissipateur thermique (21) est disposé sur la surface inférieure d'une carte de circuits imprimés (10). La carte de circuits imprimés (10) comporte un trou traversant (h1) qui pénètre la carte de circuits imprimés (10) à l'intérieur d'une région (A) dans laquelle est disposé un dispositif de circuit intégré (5). Ledit trou traversant (h1) est pourvu d'un trajet de conduction de chaleur (11). Le trajet de conduction de chaleur (11) relie l'un à l'autre le dispositif de circuit intégré 5 et le dissipateur thermique (21). Grâce à cette configuration, un composant différent du dissipateur thermique (21) peut être disposé du même côté que le dispositif de circuit intégré (5), ce qui permet ainsi d'augmenter le degré de liberté dans la disposition des composants.
(JA)
回路基板(10)の下面にはヒートシンク(21)が配置されている。回路基板(10)は、集積回路装置(5)が配置される領域(A)内に、回路基板(10)を貫通している貫通孔(h1)を有している。この貫通孔(h1)には熱伝導路(11)が設けられている。熱伝導路(11)は集積回路装置5とヒートシンク(21)とを接続している。この構造によれば、ヒートシンク(21)とは異なる部品を集積回路装置(5)と同じ側には配置することができるので、部品のレイアウトについて自由度を増やすことができる。
Latest bibliographic data on file with the International Bureau