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1. WO2021145522 - METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND STRUCTURE FOR MANUFACTURING DISPLAY APPARATUS

Publication Number WO/2021/145522
Publication Date 22.07.2021
International Application No. PCT/KR2020/009530
International Filing Date 20.07.2020
IPC
H01L 25/075 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/78
H01L 33/40 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36characterised by the electrodes
40Materials therefor
H01L 33/56 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
H01L 33/00 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
G01R 31/26 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
CPC
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 27/156
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
153in a repetitive configuration, e.g. LED bars
156two-dimensional arrays
Applicants
  • SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • TAKAGI, Takashi
  • WADA, Masaru
  • YANAGISAWA, Satoshi
  • FUJIWARA, Tsubasa
Agents
  • Y.P.LEE, MOCK & PARTNERS
Priority Data
10-2020-002383726.02.2020KR
2020-00372314.01.2020JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND STRUCTURE FOR MANUFACTURING DISPLAY APPARATUS
(FR) PROCÉDÉ DE FABRICATION D'APPAREIL D'AFFICHAGE, APPAREIL D'AFFICHAGE ET STRUCTURE DE FABRICATION D'APPAREIL D'AFFICHAGE
Abstract
(EN)
A method of manufacturing a display apparatus, a display apparatus, and a structure for manufacturing a display apparatus are provided. The method of manufacturing a display apparatus includes: forming a micro-light-emitting diode (LED) chip on a relay substrate such that a chip-side electrode is exposed; transferring the micro-LED chip from the relay substrate to a driving substrate including a driving substrate-side electrode; and bonding the chip-side electrode to the driving substrate-side electrode.
(FR)
L'invention concerne un procédé de fabrication d'un appareil d'affichage, un appareil d'affichage et une structure de fabrication d'un appareil d'affichage. Le procédé de fabrication d'un appareil d'affichage comprend les étapes consistant à : former une puce à micro-diode électroluminescente (DEL) sur un substrat de relais de telle sorte qu'une électrode côté puce est exposée ; transférer la puce à micro-DEL du substrat de relais à un substrat d'attaque comprenant une électrode côté substrat d'attaque ; et lier l'électrode côté puce à l'électrode côté substrat d'attaque.
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