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1. WO2023283819 - THERMAL CONDUCTIVE SILICONE COMPOSITION

Publication Number WO/2023/283819
Publication Date 19.01.2023
International Application No. PCT/CN2021/106191
International Filing Date 14.07.2021
IPC
C08L 83/07 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C09J 183/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
Applicants
  • DOW SILICONES CORPORATION [US]/[US]
  • DOW GLOBAL TECHNOLOGIES LLC [US]/[US]
  • HUANG, Yan [CN]/[CN] (SC)
  • BHAGWAGAR, Dorab [US]/[US] (SC)
  • WANG, LinFei [CN]/[CN] (SC)
  • CAO, ZhongWei [CN]/[CN] (SC)
Inventors
  • HUANG, Yan
  • BHAGWAGAR, Dorab
  • WANG, LinFei
  • CAO, ZhongWei
Agents
  • SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) THERMAL CONDUCTIVE SILICONE COMPOSITION
(FR) COMPOSITION DE SILICONE THERMOCONDUCTRICE
Abstract
(EN) A thermal conductive silicone composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule and having a viscosity at 25℃ of from 10 to 10,000Pa·S, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, (C) a specific adhesion promoter,(D) at least one thermal conductive filler,(E) at least one filler treating agent, and (F) a hydrosilylation reaction catalyst, with the proviso that the composition does not contain a condensation catalyst. The composition exhibits good self-adhesive properties to various substrates even when it is cured at a relatively low temperature, without impairing its flowability.
(FR) L'invention concerne une composition de silicone thermoconductrice comprenant : (A) un organopolysiloxane ayant au moins deux groupes alcényle liés à un atome de silicium par molécule et ayant une viscosité à 25°C de 10 à 10 000 Pa·S ; (B) un organopolysiloxane ayant au moins deux atomes d'hydrogène liés à un atome de silicium par molécule ; (C) un promoteur d'adhérence spécifique ; (D) au moins une charge thermoconductrice ; (E) au moins un agent de traitement de charge ; et (F) un catalyseur de réaction d'hydrosilylation, à condition que la composition ne contienne pas de catalyseur de condensation. La composition présente de bonnes propriétés auto-adhésives sur divers substrats, même lorsqu'elle est durcie à une température relativement basse, sans que sa fluidité soit altérée.
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