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1. WO2021112188 - CONNECTOR PRODUCTION METHOD AND ADHESIVE FILM

Publication Number WO/2021/112188
Publication Date 10.06.2021
International Application No. PCT/JP2020/045075
International Filing Date 03.12.2020
IPC
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 9/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 11/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/30 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
H01R 11/01 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01characterised by the form or arrangement of the conductive interconnection between their connecting locations
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 白川 哲之 SHIRAKAWA Tetsuyuki
  • 伊澤 弘行 IZAWA Hiroyuki
  • 森 拓也 MORI Takuya
  • 菊地 健太 KIKUCHI Kenta
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 平野 裕之 HIRANO Hiroyuki
Priority Data
2019-22130906.12.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONNECTOR PRODUCTION METHOD AND ADHESIVE FILM
(FR) PROCÉDÉ DE FABRICATION DE CONNECTEUR ET FILM ADHÉSIF
(JA) 接続体の製造方法及び接着剤フィルム
Abstract
(EN)
A method for producing a connector, the method comprising a step for electrically connecting a second electronic member having a second electrode to a first electronic member having a first electrode through an adhesive film, wherein the first electronic member has a surface with protrusions and recesses, the first electrode is provided at a recessed portion of the surface having protrusions and recesses, the second electrode has a generally flat surface having an area larger than that of the first electrode, the adhesive film contains first conductive particles that are dendrite-like and second conductive particles that are other than the first conductive particles and that each have a non-conductive core and a conductive layer provided on the core, the average particle size of the second conductive particles is greater than or equal to the depth of the recessed portion, and, in said step, the adhesive film is disposed between the first and second electronic members and the second electronic member is attached to the first electronic member through application of pressure so that the generally flat surface of the second electrode is electrically connected to the first electrode.
(FR)
L'invention concerne un procédé de fabrication d'un connecteur, le procédé comprenant une étape consistant à connecter électriquement un second élément électronique ayant une seconde électrode à un premier élément électronique ayant une première électrode par un film adhésif, le premier élément électronique ayant une surface munie de saillies et d'évidements, la première électrode est ménagée au niveau d'une partie évidée de la surface munie de saillies et d'évidements, la seconde électrode possède une surface généralement plate ayant une surface plus grande que celle de la première électrode, le film adhésif contient des premières particules conductrices qui sont des particules de type dendrite et des secondes particules conductrices qui sont autres que les premières particules conductrices et qui possèdent chacune un noyau non conducteur et une couche conductrice ménagée sur le noyau, la taille particulaire moyenne des secondes particules conductrices est supérieure ou égale à la profondeur de la partie évidée, et, dans ladite étape, le film adhésif est disposé entre les premier et second éléments électroniques et le second élément électronique est attaché au premier élément électronique par le biais d'une application de pression de sorte que la surface généralement plate de la seconde électrode soit connectée électriquement à la première électrode.
(JA)
接着剤フィルムを介して、第1の電極を有する第1の電子部材に第2の電極を有する第2の電子部材を電気的に接続する工程を備える、接続体の製造方法であって、第1の電子部材は凹凸状の表面を有し、第1の電極は凹凸状の表面の凹部に設けられており、第2の電極は第1の電極の面積より大きな面積の略平坦面を有する電極であり、接着剤フィルムは、デンドライト状の導電粒子である第1の導電粒子と、第1の導電粒子以外の導電粒子であって、非導電性の核体及び該核体上に設けられた導電層を有する導電粒子である第2の導電粒子と、を含有し、第2の導電粒子の平均粒径が凹部の深さが以上であり、上記工程において、第1の電子部材と第2の電子部材との間に接着剤フィルムを配置して、第1の電極に第2の電極の略平坦面が電気的に接続されるように、第1の電子部材に第2の電子部材を圧着する、製造方法。
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