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1. WO2021111296 - PATTERNED DESIGN FOR THERMAL MANAGEMENT OF TWO-PHASE IMMERSION COOLING SYSTEM FOR ELECTRONICS

Publication Number WO/2021/111296
Publication Date 10.06.2021
International Application No. PCT/IB2020/061326
International Filing Date 01.12.2020
IPC
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H01L 23/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50for integrated circuit devices
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • PALANISWAMY, Ravi
  • MOON, Sung W.
  • BADRI, Brinda B.
  • FOO, Siang Sin
Agents
  • VIETZKE, Lance L.,
  • FLORCZAK, Yen Tong,
  • BLANK, Colene H.,
  • HARTS, Dean M. ,
  • GEISE, C. Michael,
  • LEVINSON, Eric D.,
  • NOWAK, Sandra K.,
  • RINGSRED, Ted K.,
Priority Data
62/944,42206.12.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PATTERNED DESIGN FOR THERMAL MANAGEMENT OF TWO-PHASE IMMERSION COOLING SYSTEM FOR ELECTRONICS
(FR) CONCEPTION À MOTIFS POUR LA GESTION THERMIQUE D'UN SYSTÈME DE REFROIDISSEMENT PAR IMMERSION DIPHASIQUE POUR L'ÉLECTRONIQUE
Abstract
(EN)
A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.
(FR)
L'invention concerne un film de refroidissement direct à la puce pour refroidissement diphasique. Le film comprend une couche diélectrique ayant une première surface destinée à être fixée à une plaque froide ou à des circuits et ayant une seconde surface. Une couche métallique est déposée sur la seconde surface de la couche diélectrique avec un motif de caractéristiques sur un côté opposé à la couche diélectrique. Ce motif de surface fournit une surface accrue et de multiples sites de nucléation pour la formation de bulles pour un refroidissement diphasique. Les caractéristiques peuvent également comprendre des nodules métalliques pour améliorer encore la nucléation.
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