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1. WO2021110275 - METHOD OF SELECTIVELY ETCHING A METAL COMPONENT

Publication Number WO/2021/110275
Publication Date 10.06.2021
International Application No. PCT/EP2019/083906
International Filing Date 05.12.2019
IPC
H01L 39/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
24Processes or apparatus specially adapted for the manufacture or treatment of devices provided for in group H01L39/135
C09K 13/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
13Etching, surface-brightening or pickling compositions
CPC
C09K 13/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
13Etching, surface-brightening or pickling compositions
H01L 39/24
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39Devices using superconductivity; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
24Processes or apparatus peculiar to the manufacture or treatment of devices provided for in H01L39/00 or of parts thereof
Applicants
  • MICROSOFT TECHNOLOGY LICENSING LLC [US]/[US]
  • MARCUS, Charles, Masamed [US]/[DK] (KN)
Inventors
  • MARCUS, Charles, Masamed
  • VAITIEKENAS, Saulius
  • UPADHYAY, Shivendra
Agents
  • TOWNSEND, Martyn, James
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF SELECTIVELY ETCHING A METAL COMPONENT
(FR) PROCÉDÉ DE GRAVURE SÉLECTIVE D'UN COMPOSANT MÉTALLIQUE
Abstract
(EN)
A method of selectively etching a metal component (12) of a workpiece further comprising a ferromagnetic insulator component (14). The method comprises contacting the metal component with an etchant solution. The etchant solution comprises a basic etchant and a solvent. The method is useful in the context of the fabrication of semiconductor-superconductor-ferromagnetic insulator hybrid devices, for example. The etchant solution may not attack the ferromagnetic insulator component. Also provided is a composition for etching a metal, and a kit comprising the composition and a composition for depositing a styrene-acrylate copolymer on a surface.
(FR)
L'invention concerne un procédé de gravure sélective d'un composant métallique (12) d'une pièce à travailler comprenant en outre un composant isolant ferromagnétique (14). Le procédé comprend la mise en contact du composant métallique avec une solution d'agent de gravure. La solution d'agent de gravure comprend un agent de gravure basique et un solvant. Le procédé est utile dans le contexte de la fabrication de dispositifs hybrides semi-conducteurs-isolants ferromagnétiques, par exemple. La solution d'agent de gravure peut ne pas attaquer le composant d'isolant ferromagnétique. L'invention concerne également une composition pour la gravure d'un métal, ainsi qu'un kit comprenant la composition et une composition pour le dépôt d'un copolymère de styrène-acrylate sur une surface.
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