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1. WO2021145294 - CONNECTION TERMINAL

Publication Number WO/2021/145294
Publication Date 22.07.2021
International Application No. PCT/JP2021/000601
International Filing Date 12.01.2021
IPC
C22C 9/04 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
9Alloys based on copper
04with zinc as the next major constituent
C22F 1/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08of copper or alloys based thereon
H01R 13/03 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/7087
02Contact members
03characterised by the material, e.g. plating or coating materials
Applicants
  • 株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP]/[JP]
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP]/[JP]
  • 住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP]/[JP]
  • 三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP]/[JP]
Inventors
  • 境 利郎 SAKAI, Toshiro
  • 古川 欣吾 FURUKAWA, Kingo
  • 増田 健志 MASUDA, Takeshi
  • 桑原 鉄也 KUWABARA, Tetsuya
  • 高崎 教男 TAKASAKI, Michio
Agents
  • 特許業務法人上野特許事務所 WENO & PARTNERS
Priority Data
2020-00371214.01.2020JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONNECTION TERMINAL
(FR) BORNE DE CONNEXION
(JA) 接続端子
Abstract
(EN)
Provided is a connection terminal comprising a base material of a copper alloy that contains, in mass percentages, 21% ≤ Zn ≤ 27%, 0.6% ≤ Sn ≤ 0.9%, 2.5% ≤ Ni ≤ 3.7%, and 0.01% ≤ P ≤ 0.03%, and containing Cu and unavoidable impurities as the remainder thereof, and that has a 0.2% proof stress of 620-700 MPa and a conductivity of 15-20% IASC.
(FR)
L'invention concerne une borne de connexion comprenant un matériau de base d'un alliage de cuivre qui contient, en pourcentages en masse, 21 % ≤ Zn ≤ 27 %, 0,6 % ≤ Sn ≤ 0,9 %, 2,5 % ≤ Ni ≤ 3,7 % et 0,01 % ≤ P ≤ 0,03 %, et le reste étant composé de Cu et d’impuretés inévitables, et qui présente une limite d’élasticité conventionnelle à 0,2 % de 620 à 700 MPa et une conductivité de 15 à 20 % IASC.
(JA)
質量%で、21%≦Zn≦27%、0.6%≦Sn≦0.9%、2.5%≦Ni≦3.7%、0.01%≦P≦0.03%を含有し、残部がCuおよび不可避的不純物よりなり、620MPa以上、700MPa以下の0.2%耐力と、15%IACS以上、20%IACS以下の導電率と、を有する銅合金を基材としてなる接続端子とする。
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