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1. WO2021107654 - PRINTED CIRCUIT BOARD

Publication Number WO/2021/107654
Publication Date 03.06.2021
International Application No. PCT/KR2020/017003
International Filing Date 26.11.2020
IPC
H05K 1/11 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
Applicants
  • 엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR]/[KR]
Inventors
  • 구교헌 KOO, Kyo Hun
  • 이진학 LEE, Jin Hak
  • 정인호 JEONG, In Ho
Agents
  • 허용록 HAW, Yong Noke
Priority Data
10-2019-015396827.11.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) PRINTED CIRCUIT BOARD
(FR) CARTE À CIRCUIT IMPRIMÉ
(KO) 인쇄회로기판
Abstract
(EN)
A printed circuit board according to an embodiment comprises: an insulation layer including a via hole; a connection part that includes a via disposed in the via hole of the insulation layer, the via being disposed inside the via hole of the insulation layer; a first pad that is disposed on the upper surface of the insulation layer and the upper surface of the connection part; and a second pad that is disposed under the lower surface of the insulation layer and the lower surface of the connection part, wherein the upper surface of the connection part has a downwardly concave shape, the lower surface of the connection part has an upwardly concave shape, the lower surface of the first pad has a convex shape corresponding to the upper surface of the connection part, and the upper surface of the second pad has a convex shape corresponding to the lower surface of the connection part.
(FR)
Carte à circuit imprimé, selon un mode de réalisation, comprenant : une couche d'isolation comportant un trou d'interconnexion; une partie de connexion qui comprend un trou métallisé disposé dans le trou d'interconnexion de la couche d'isolation, le trou métallisé étant disposé à l'intérieur du trou d'interconnexion de la couche d'isolation; une première pastille qui est disposée sur la surface supérieure de la couche d'isolation et la surface supérieure de la partie de connexion; et une seconde pastille qui est disposée sous la surface inférieure de la couche d'isolation et la surface inférieure de la partie de connexion, la surface supérieure de la partie de connexion ayant une forme concave vers le bas, la surface inférieure de la partie de connexion ayant une forme concave vers le haut, la surface inférieure de la première pastille ayant une forme convexe correspondant à la surface supérieure de la partie de connexion, et la surface supérieure de la seconde pastille ayant une forme convexe correspondant à la surface inférieure de la partie de connexion.
(KO)
실시 예에 따른 인쇄히로기판은 비아 홀을 포함하는 절연층; 상기 절연층의 비아 홀에 배치된 비아를 포함하고, 상기 비아는, 상기 절연층의 상기 비아 홀 내에 배치되는 연결부; 상기 절연층의 상면 및 상기 연결부의 상면 위에 배치된 제1 패드; 및 상기 절연층의 하면 및 상기 연결부의 하면 아래에 배치된 제2 패드를 포함하고, 상기 연결부의 상면은 하측 방향으로 오목한 형상을 가지고, 상기 연결부의 하면은 상측 방향으로 오목한 형상을 가지며, 상기 제1 패드의 하면은 상기 연결부의 상면에 대응하는 볼록한 형상을 가지고, 상기 제2 패드의 상면은 상기 연결부의 하면에 대응하는 볼록한 형상을 가진다.
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