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1. WO2021080775 - SMALL BATCH POLISHING FLUID DELIVERY FOR CMP

Publication Number WO/2021/080775
Publication Date 29.04.2021
International Application No. PCT/US2020/054626
International Filing Date 07.10.2020
IPC
B24B 57/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
CPC
B24B 37/20
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
B24B 57/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • TOLLES, Robert D.
  • LIEBSCHER, Kirk
Agents
  • PATTERSON, B. Todd
  • HAMMACK, Marcus W.
Priority Data
16/803,22327.02.2020US
62/926,09725.10.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SMALL BATCH POLISHING FLUID DELIVERY FOR CMP
(FR) DÉLIVRANCE DE FLUIDE DE POLISSAGE PAR PETITS LOTS POUR POLISSAGE CHIMICO-MÉCANIQUE
Abstract
(EN)
In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve. Typically, the valve is then closed and the transferred batch can be delivered to a polishing pad through the dispense nozzle fluidly coupled to the second chamber, often by pressurizing the second chamber using pressurized gas delivered thereinto through the second delivery line.
(FR)
Un mode de réalisation de l'invention concerne un appareil de délivrance de fluide, lequel appareil comprend un corps de récipient ayant une première chambre et une seconde chambre disposées à l'intérieur de celui-ci, une pluralité de premières lignes de délivrance couplées de manière fluidique à la première chambre, une buse de distribution couplée de manière fluidique à la seconde chambre, une seconde ligne de délivrance couplée de manière fluidique à la seconde chambre, et une vanne disposée entre les première et seconde chambres. Ici, une communication fluidique entre la première chambre et la seconde chambre est commandée par la vanne disposée entre celles-ci. Des composants de fluide de polissage s'écoulent dans la première chambre à travers la pluralité de premières lignes de délivrance couplées de manière fluidique à celle-ci pour former un lot de fluide de polissage. Une fois formé, le lot de fluide de polissage est transféré dans la seconde chambre par une ouverture de la vanne. Typiquement, la vanne est ensuite fermée et le lot transféré peut être délivré à un tampon de polissage par l'intermédiaire de la buse de distribution couplée de manière fluidique à la seconde chambre, souvent par une pressurisation de la seconde chambre à l'aide de gaz sous pression délivré à l'intérieur de celle-ci par l'intermédiaire de la seconde ligne de délivrance.
Also published as
Latest bibliographic data on file with the International Bureau