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1. WO2022160084 - SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF

Publication Number WO/2022/160084
Publication Date 04.08.2022
International Application No. PCT/CN2021/073708
International Filing Date 26.01.2021
IPC
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/492 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
492Bases or plates
Applicants
  • YANGTZE MEMORY TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • ZENG, Xinru
  • CHEN, Peng
  • ZHOU, Houde
Agents
  • NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD.
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
(FR) STRUCTURE DE SUBSTRAT ET PROCÉDÉS DE FABRICATION ET D'ENCAPSULATION CORRESPONDANTS
Abstract
(EN) A method for fabricating a substrate structure for packaging includes providing a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a metal layer at a second surface of the core substrate opposite to the first surface; forming a conductive structure, for pasting the substrate structure onto an external component, on each of the plurality of conductive pads; forming a molding compound on the first surface of the core substrate and to encapsulate the conductive structure; and forming a plurality of packaging pads by patterning the metal layer at the second surface of the core substrate.
(FR) Un procédé de fabrication d'une structure de substrat pour encapsulation comprend la fourniture d'un substrat central, d'une pluralité de plots conducteurs sur une première surface du substrat central, et d'une couche métallique sur une seconde surface du substrat central opposée à la première surface ; la formation d'une structure conductrice, pour coller la structure de substrat sur un composant externe, sur chaque plot de la pluralité de plots conducteurs ; la formation d'un composé de moulage sur la première surface du substrat central pour encapsuler la structure conductrice ; et la formation d'une pluralité de plots d'encapsulation par formation de motifs sur la couche métallique au niveau de la seconde surface du substrat central.
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