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1. WO2022160053 - EBEAM INSPECTION

Publication Number WO/2022/160053
Publication Date 04.08.2022
International Application No. PCT/CA2022/050118
International Filing Date 28.01.2022
IPC
B81C 99/00 2010.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
99Subject matter not provided for in other groups of this subclass
G01R 31/00 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Applicants
  • VUEREAL INC. [CA]/[CA]
Inventors
  • CHAJI, Gholamreza
  • FATHI, Ehsanollah
  • PARK, Chang Ho
Agents
  • ROWAND LLP
Priority Data
63/143,22029.01.2021US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) EBEAM INSPECTION
(FR) INSPECTION PAR FAISCEAUX D'ÉLECTRONS
Abstract
(EN) The present disclosure relates to integrating microdevices into a system substrate. In particular it relates to measuring microdevices using an electron beam method using one or several tips as Ebeam sources. The disclosure further outlines methods to target Ebeams effectively to produce an optimum result with minimal damage to adjacent microdevices and components.
(FR) La présente invention concerne l'intégration de microdispositifs dans un substrat de système. En particulier, l'invention concerne la mesure de microdispositifs à l'aide d'un procédé à faisceaux d'électrons utilisant une ou plusieurs pointes en tant que sources de faisceaux d'électrons. L'invention concerne en outre des procédés pour cibler des faisceaux d'électrons de façon efficace pour produire un résultat optimal avec un minimum de dommages aux micro-dispositifs et composants adjacents.
Latest bibliographic data on file with the International Bureau