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1. WO2022009700 - LIQUID SUPPLY DEVICE AND POLISHING DEVICE

Publication Number WO/2022/009700
Publication Date 13.01.2022
International Application No. PCT/JP2021/024136
International Filing Date 25.06.2021
IPC
B24B 57/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/00 2012.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
B24B 53/017 2012.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53Devices or means for dressing or conditioning abrasive surfaces
017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 55/06 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
55Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
06Dust extraction equipment on grinding or polishing machines
H01L 21/304 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 株式会社荏原製作所 EBARA CORPORATION [JP]/[JP]
Inventors
  • 山口 都章 YAMAGUCHI Kuniaki
  • 磯部 壮一 ISOBE Soichi
  • 新海 健史 SHINKAI Kenji
  • 吉成 大 YOSHINARI Dai
  • 田村 元成 TAMURA Masayuki
Agents
  • 大野 聖二 OHNO Seiji
  • 松野 知紘 MATSUNO Tomohiro
  • 野本 裕史 NOMOTO Hiroshi
Priority Data
2020-11620006.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIQUID SUPPLY DEVICE AND POLISHING DEVICE
(FR) DISPOSITIF D'ALIMENTATION EN LIQUIDE ET DISPOSITIF DE POLISSAGE
(JA) 液体供給装置および研磨装置
Abstract
(EN) This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table from a slurry discharge port at a tip section thereof; and a plurality of spray nozzles which are provided to be aligned in the longitudinal direction of the rocking arm and spray a cleaning fluid onto the polishing table. The spray nozzles positioned at the tip section of the rocking arm are provided obliquely so as to be capable of cleaning a drop position of slurry onto the polishing table, the slurry being discharged from the slurry discharge nozzles.
(FR) La présente invention concerne un dispositif d'alimentation en liquide comprenant : un bras oscillant qui peut balancer horizontalement le côté supérieur d'une table de polissage ; un tube à boue qui s'étend dans la direction longitudinale du bras oscillant et évacue la boue sur la table de polissage à partir d'un orifice d'évacuation de boue au niveau d'une section de pointe de celui-ci ; et une pluralité de buses de pulvérisation qui sont disposées de façon à être alignées dans la direction longitudinale du bras oscillant et pulvériser un fluide de nettoyage sur la table de polissage. Les buses de pulvérisation positionnées au niveau de la section de pointe du bras oscillant sont disposées de manière oblique de façon à pouvoir nettoyer une position de chute de la boue sur la table de polissage, la boue étant évacuée à partir des buses de décharge de boue.
(JA) 液体供給装置は、研磨テーブルの上方を水平に揺動可能な揺動アームと、揺動アームの長手方向に沿って延ばされており先端部のスラリ吐出口から研磨テーブル上にスラリを吐出するスラリチューブと、揺動アームの長手方向に沿って並んで設けられ研磨テーブル上に洗浄流体を噴射する複数の噴射ノズルと、を備える。揺動アームの先端部に位置する噴射ノズルは、スラリ吐出ノズルから吐出されたスラリの研磨テーブル上における滴下位置を洗浄できるように斜めに設けられている。
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