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1. WO2022009685 - METHOD FOR PRODUCING HETEROCONDUCTIVE MEMBER

Publication Number WO/2022/009685
Publication Date 13.01.2022
International Application No. PCT/JP2021/023917
International Filing Date 24.06.2021
IPC
C25D 11/04 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
C25D 11/12 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
12Anodising more than once, e.g. in different baths
C25D 11/20 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
18After-treatment, e.g. pore-sealing
20Electrolytic after-treatment
C25D 11/24 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
18After-treatment, e.g. pore-sealing
24Chemical after-treatment
C25D 11/26 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
26of refractory metals or alloys based thereon
C25D 11/34 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
34of metals or alloys not provided for in groups C25D11/04-C25D11/3299
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 堀田 吉則 HOTTA Yoshinori
Agents
  • 伊東 秀明 ITOH Hideaki
  • 三橋 史生 MITSUHASHI Fumio
Priority Data
2020-11933710.07.2020JP
2020-12344020.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR PRODUCING HETEROCONDUCTIVE MEMBER
(FR) PROCÉDÉ DE FABRICATION D'ÉLÉMENT CONDUCTEUR ANISOTROPE
(JA) 異方導電性部材の製造方法
Abstract
(EN) The purpose of the present invention is to provide a method for producing a heteroconductive member in which it is possible to suppress variations in the heights of protruding portions of a conductive path. A method for producing a heteroconductive member comprising an insulating base material, a plurality of pass-through paths that pass through the insulating base material in the thickness direction thereof, and a plurality of conductive paths composed of a conductive material that fills the inside of the plurality of pass-through paths, one end of the plurality of conductive paths being provided so as to protrude from at least one surface of the insulating base material, the method comprising: a preparation step in which a metal-filled microstructure having an unfilled region therein is prepared; a water repellency step in which the inner walls of the pass-through paths in the unfilled region are made to be water repellant; and a protrusion step in which, after the water repellency step, a treatment liquid is applied to the surface of the metal-filled microstructure, the surface of the insulating base material is selectively and partially removed in the thickness direction, and one end of the plurality of conductive paths is made to protrude from the surface of the insulating base material.
(FR) L'invention a pour objet de fournir un procédé de fabrication d'élément conducteur anisotrope qui permet d'inhiber une variation de hauteur de portions saillie de trajets de conduction. Le procédé de fabrication d'élément conducteur anisotrope de l'invention consiste en un procédé de fabrication d'un élément conducteur anisotrope qui possède un substrat d'isolation, une pluralité de trajets traversants passant au travers du substrat d'isolation dans sa direction épaisseur, et une pluralité de trajets de conduction configurée par une matière conductrice remplissant la partie interne de la pluralité de trajets traversants, et dans lequel une extrémité de la pluralité de trajets de conduction est agencée dans un état de saillie à partir d'au moins une face du substrat d'isolation. Ce procédé de fabrication d'élément conducteur anisotrope présente : une étape de préparation au cours de laquelle est préparée une microstructure remplie de métal dans laquelle une région non remplie subsiste ; une étape d'hydrofugation au cours de laquelle la paroi interne des trajets traversants dans la région non remplie, est rendue hydrofuge ; et une étape de formation de saillie au cours de laquelle, après l'étape d'hydrofugation, un liquide de traitement est appliqué sur la surface de la microstructure remplie de métal, la surface du substrat d'isolation est en partie retirée de manière sélective dans une direction épaisseur, et une extrémité de la pluralité de trajets de conduction est mise en saillie à partir de la surface du substrat d'isolation.
(JA) 本発明は、導通路の突出部分の高さのバラツキを抑制することができる異方導電性部材の製造方法を提供することを課題とする。本発明の異方導電性部材の製造方法は、絶縁性基材と、絶縁性基材の厚み方向に貫通した複数の貫通路と、複数の貫通路の内部に充填された導電性物質で構成された複数の導通路とを有し、複数の導通路の一端が絶縁性基材の少なくとも一方の面から突出した状態で設けられる異方導電性部材の製造方法であって、未充填領域が存在している金属充填微細構造体を準備する準備工程と、未充填領域における貫通路の内壁を撥水化する撥水化工程と、撥水化工程後に、金属充填微細構造体の表面に処理液を付与し、選択的に絶縁性基材の表面を厚み方向に一部除去し、複数の導通路の一端を絶縁性基材の表面から突出させる突出工程と、を有する、異方導電性部材の製造方法である。
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