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1. WO2020153219 - PROCESSING DEVICE AND PROCESSING METHOD

Publication Number WO/2020/153219
Publication Date 30.07.2020
International Application No. PCT/JP2020/001241
International Filing Date 16.01.2020
IPC
B24B 55/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
55Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
06Dust extraction equipment on grinding or polishing machines
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP]
Inventors
  • 池上 和哉 IKEUE, Kazuya
Agents
  • 金本 哲男 KANEMOTO, Tetsuo
  • 萩原 康司 HAGIWARA, Yasushi
  • 扇田 尚紀 OGITA, Naoki
  • 三根 卓也 MINE, Takuya
Priority Data
2019-01050424.01.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROCESSING DEVICE AND PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT ET PROCÉDÉ DE TRAITEMENT
(JA) 加工装置及び加工方法
Abstract
(EN)
This processing device that processes a substrate is provided with: a substrate holding part having a substrate holding surface that suctions and holds the substrate; and an outer edge washing part that washes an outer edge part of the substrate holding surface. In addition, this processing method for processing the back surface of the substrate using the processing device includes: processing the back surface of the substrate in a state where the front surface of the substrate is suctioned and held by the substrate holding surface of the substrate holding part; and washing the outer edge part of the substrate holding surface.
(FR)
Ce dispositif de traitement qui traite un substrat comprend : une partie de maintien de substrat ayant une surface de support de substrat qui aspire et maintient le substrat ; et une partie de lavage de bord externe qui lave une partie de bord externe de la surface de support de substrat. De plus, ce procédé de traitement pour traiter la surface arrière du substrat à l'aide du dispositif de traitement consiste à : traiter la surface arrière du substrat dans un état où la surface avant du substrat est aspirée et maintenue par la surface de maintien de substrat de la partie de maintien de substrat ; et laver la partie de bord externe de la surface de maintien de substrat.
(JA)
基板を加工する加工装置であって、前記基板を吸着保持する基板保持面を有する基板保持部と、前記基板保持面の外縁部を洗浄する外縁洗浄部を備える。または、前記加工装置を用いた基板の裏面を加工する加工方法であって、基板保持部の基板保持面で前記基板の表面を吸着保持した状態で、前記基板の裏面を加工することと、前記基板保持面の外縁部を洗浄することと、を含む。
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