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1. WO2020150914 - PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF

Publication Number WO/2020/150914
Publication Date 30.07.2020
International Application No. PCT/CN2019/072781
International Filing Date 23.01.2019
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08K 3/36 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/00 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
Applicants
  • 律胜科技股份有限公司 MICROCOSM TECHNOLOGY CO., LTD [CN]/[CN]
Inventors
  • 黄堂杰 HUANG, Tang Chieh
  • 庄朝钦 CHUANG, Chau Chin
  • 史谕樵 SHIH, Yu Chiao
  • 谢坤翰 HSIEH, Kun Han
Agents
  • 北京市金杜律师事务所 KING & WOOD MALLESONS
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF
(FR) COMPOSITION DE RÉSINE DE POLYIMIDE PHOTOSENSIBLE ET FILM ASSOCIÉ
(ZH) 感光性聚酰亚胺树脂组合物及其聚酰亚胺膜
Abstract
(EN)
The present invention provides a photosensitive polyimide resin composition, containing: (a) a photosensitive polyimide, represented by formula (1); (b) a filler, selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide, the particle size of the filler being between 10 nanometers and 1.0 micrometer; (c) a photo radical initiator; (d) a radical polymerizable compound; (e) a solvent, used for dissolving the photosensitive polyimide; X is derived from tetracarboxylic dianhydride, Y is derived from diamine, and m is a positive integer from 1 to 5000.
(FR)
La présente invention concerne une composition de résine de polyimide photosensible contenant : (A) un polyimide photosensible représenté par la formule (1) ; (b) une charge choisie parmi un ou plusieurs éléments parmi l'alumine, le graphène, l'argile inorganique, la silice et l'oxyde de zinc, la taille des particules de la charge étant comprise entre 10 nanomètres et 1,0 micromètre ; (c) un initiateur photoradicalaire ; (d) un composé polymérisable par voie radicalaire ; (e) un solvant servant à dissoudre le polyimide photosensible ; X est dérivé de dianhydride tétracarboxylique, Y est dérivé de diamine, et m représente un nombre entier positif compris entre 1 et 5000.
(ZH)
本发明提供一种感光性聚酰亚胺树脂组合物,其包含:(a)感光性聚酰亚胺,其由式(1)所表示;(b)填充剂,其选自氧化铝、石墨烯、无机粘土、氧化硅及氧化锌中的一种或多种,且该填充剂粒径介于10纳米~1.0微米;(c)光自由基引发剂;(d)自由基聚合性化合物;(e)溶剂,其用于溶解该感光性聚酰亚胺,其中,X来源于四羧酸二酐,Y来源于二胺,m为1~5000中的正整数。
Also published as
CN201980001576.0
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