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1. WO2020150893 - INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

Publication Number WO/2020/150893
Publication Date 30.07.2020
International Application No. PCT/CN2019/072669
International Filing Date 22.01.2019
IPC
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
Applicants
  • YANGTZE MEMORY TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • CHEN, Peng
  • ZHOU, Houde
  • ZHANG, Baohua
  • GU, Chao
Agents
  • NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
(FR) STRUCTURE D'EMBALLAGE DE CIRCUIT INTÉGRÉ ET SON PROCÉDÉ DE FABRICATION
Abstract
(EN)
An integrated circuit (IC) packaging structure includes a packaging substrate, one or a plurality of dies, an encapsulation material, at least one trench, and a heat dissipation structure. The one or the plurality of the dies is disposed on the packaging substrate. The encapsulation material is disposed on the packaging substrate and is configured to encapsulate the one or the plurality of the dies on the packaging substrate. The at least one trench is disposed in the encapsulation material. At least a part of the heat dissipation structure is disposed in the at least one trench. The cooling capability of the IC packaging structure may be improved by the heat dissipation structure without increasing the size of the IC packaging structure significantly.
(FR)
La présente invention concerne une structure d'emballage de circuit intégré (IC) comprenant un substrat d'emballage, une ou plusieurs puces, un matériau d'encapsulation, au moins une tranchée, et une structure de dissipation de chaleur. La ou les puces sont disposées sur le substrat d'emballage. Le matériau d'encapsulation est disposé sur le substrat d'emballage et est configuré pour encapsuler l'une ou la pluralité des puces sur le substrat d'emballage. La ou les tranchées sont disposées dans le matériau d'encapsulation. Au moins une partie de la structure de dissipation de chaleur est disposée dans la ou les tranchées. La capacité de refroidissement de la structure d'emballage de CI peut être améliorée par la structure de dissipation de chaleur sans augmenter significativement la taille de la structure d'emballage de CI.
Also published as
CN201980000233.2
Latest bibliographic data on file with the International Bureau