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1. WO2020101273 - LED TRANSFER DEVICE COMPRISING MASK AND MICRO LED TRANSFERRING METHOD USING THE SAME

Publication Number WO/2020/101273
Publication Date 22.05.2020
International Application No. PCT/KR2019/015110
International Filing Date 08.11.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
Applicants
  • SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • PARK, Sangmoo
  • KWAG, Doyoung
  • KIM, Eunhye
  • OH, Minsub
  • LEE, Yoonsuk
Agents
  • KIM, Tae-hun
  • JEONG, Hong-sik
Priority Data
10-2018-014142916.11.2018KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LED TRANSFER DEVICE COMPRISING MASK AND MICRO LED TRANSFERRING METHOD USING THE SAME
(FR) DISPOSITIF DE TRANSFERT DE DEL COMPRENANT UN MASQUE ET PROCÉDÉ DE TRANSFERT DE MICRO DEL UTILISANT CELUI-CI
Abstract
(EN)
A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.
(FR)
La présente invention concerne un dispositif de transfert de micro DEL. Le dispositif de transfert de micro DEL comprend une partie de transfert configurée pour agencer un premier substrat dans lequel une pluralité de DEL sont disposées sur une surface inférieure par rapport à une surface supérieure d'un second substrat ; une mémoire stockant des informations caractéristiques de chaque DEL de la pluralité de DEL ; une source de lumière laser configurée pour émettre une lumière laser ; un masque comprenant une pluralité de volets configurés pour ouvrir et fermer de manière sélective une pluralité d'ouvertures du masque, le masque étant intercalé entre le premier substrat et la source de lumière laser ; et un processeur configuré pour identifier une DEL parmi la pluralité de DEL qui doivent être disposées sur le second substrat sur la base des informations caractéristiques stockées, et pour commander le masque de telle sorte qu'un volet parmi la pluralité de volets qui correspond à la DEL, soit ouvert.
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