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1. WO2020033631 - HIGH-TEMPERATURE SOLDERS AND CONNECTIONS FORMED THEREFROM

Publication Number WO/2020/033631
Publication Date 13.02.2020
International Application No. PCT/US2019/045633
International Filing Date 08.08.2019
IPC
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
30
with the principal constituent melting at less than 1550°C
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
1
Making non-ferrous alloys
04
by powder metallurgy
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B23K 35/02 (2006.01)
B23K 35/30 (2006.01)
C22C 1/04 (2006.01)
B22F 1/00 (2006.01)
Applicants
  • KUPRION INC. [US/US]; 4425 Fortran Drive Suite K San Jose, California 95134, US
  • LOCKHEED MARTIN CORPORATION [US/US]; 6801 Rockledge Drive Bethesda, Maryland 20817-1877, US
Inventors
  • ZINN, Alfred A.; US
  • STOLTENBERG, Randall; US
Agents
  • KAISER, Iona N.; US
  • THRASH, Thomas P.; US
Priority Data
62/715,91108.08.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HIGH-TEMPERATURE SOLDERS AND CONNECTIONS FORMED THEREFROM
(FR) SOUDURES À HAUTE TEMPÉRATURE ET CONNEXIONS FORMÉES À PARTIR DE CELLES-CI
Abstract
(EN)
Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle paste compositions may comprise copper nanoparticles and 0.01-15 wt. % of a grain growth inhibitor or a precursor to a grain growth inhibitor admixed with the copper nanoparticles, in which the grain growth inhibitor comprises a metal. The grain growth inhibitor is insoluble in a bulk copper matrix and is capable of residing at one or more grain boundaries in the bulk copper matrix. The one or more grain boundaries may be formed after the copper nanoparticles undergo consolidation to form bulk copper. The grain growth inhibitor may comprise various metals that are insoluble in bulk copper.
(FR)
Selon l'invention, des compositions de pâte de nanoparticules de cuivre peuvent être formulées pour former des connexions qui sont capables de fonctionner à des températures élevées en incluant une quantité appropriée d'inhibiteur de croissance de grains avec des nanoparticules de cuivre. De telles compositions de pâte de nanoparticules peuvent comprendre des nanoparticules de cuivre et 0,01 à 15 % en poids d'un inhibiteur de croissance de grains ou d'un précurseur d'un inhibiteur de croissance de grains incorporé par mélange aux nanoparticules de cuivre, l'inhibiteur de croissance de grains comprenant un métal. L'inhibiteur de croissance de grains est insoluble dans une matrice de masse cuivre et est capable de résider à une ou plusieurs limites de grain dans la matrice de masse de cuivre. La ou les limites de grain peuvent être formées après que les nanoparticules de cuivre ont subi une consolidation pour former une masse de cuivre. L'inhibiteur de croissance de grains peut comprendre divers métaux qui sont insolubles dans la masse cuivre.
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