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1. WO2020032106 - LOCAL POLISHING METHOD, LOCAL POLISHING DEVICE, AND CORRECTIVE POLISHING APPARATUS USING SAID LOCAL POLISHING DEVICE

Publication Number WO/2020/032106
Publication Date 13.02.2020
International Application No. PCT/JP2019/031137
International Filing Date 07.08.2019
IPC
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
1
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
[IPC code unknown for B24B 37/05]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B24B 37/00 (2012.01)
B24B 1/00 (2006.01)
B24B 37/005 (2012.01)
C09K 3/14 (2006.01)
Applicants
  • 国立大学法人東京大学 THE UNIVERSITY OF TOKYO [JP/JP]; 東京都文京区本郷七丁目3番1号 3-1, Hongo 7-chome, Bunkyo-ku, Tokyo 1138654, JP
  • 夏目光学株式会社 NATSUME OPTICAL CORP. [JP/JP]; 長野県飯田市鼎上茶屋3461 3461, Kanaekamichaya, Iida-shi, Nagano 3950808, JP
Inventors
  • 三村 秀和 MIMURA Hidekazu; JP
  • 橋爪 寛和 HASHIZUME Hirokazu; JP
  • 松澤 雄介 MATSUZAWA Yusuke; JP
Agents
  • 柳野 隆生 YANAGINO Takao; JP
  • 柳野 嘉秀 YANAGINO Yoshihide; JP
  • 森岡 則夫 MORIOKA Norio; JP
  • 関口 久由 SEKIGUCHI Hisayoshi; JP
  • 中川 正人 NAKAGAWA Masato; JP
Priority Data
2018-15074809.08.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOCAL POLISHING METHOD, LOCAL POLISHING DEVICE, AND CORRECTIVE POLISHING APPARATUS USING SAID LOCAL POLISHING DEVICE
(FR) PROCÉDÉ DE POLISSAGE LOCAL, DISPOSITIF DE POLISSAGE LOCAL ET APPAREIL DE POLISSAGE CORRECTIF UTILISANT LEDIT DISPOSITIF DE POLISSAGE LOCAL
(JA) 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
Abstract
(EN)
[Problem] To provide a local polishing technique that stabilizes the volume of processing by means of local polishing, that can achieve a high level of corrective space resolution, and that is preferable for corrective polishing. [Solution] Press polishing is executed while a polishing solution, obtained by dispersing abrasive grains 81 comprising organic particles having an average particle diameter of at least 5 μm in a liquid, is being supplied to a space between a workpiece 9 and a workpiece-polishing rotary tool 11 that is to be locally pressed against the workpiece 9. The rotary tool 11 is composed of an elastic material.
(FR)
La présente invention vise à fournir une technique de polissage local qui stabilise le volume de traitement au moyen d'un polissage local, qui peut atteindre un niveau élevé de résolution spatiale corrective et qui est préférable pour un polissage correctif. La solution selon l'invention concerne un polissage à la presse exécuté pendant qu'une solution de polissage, obtenue par dispersion de grains abrasifs (81) comprenant des particules organiques possédant un diamètre de particule moyen d'au moins 5 µm dans un liquide, est fournie à un espace entre une pièce à travailler (9) et un outil rotatif de polissage de pièce à travailler (11) qui doit être pressé localement contre la pièce à travailler (9). L'outil rotatif (11) est constitué d'un matériau élastique.
(JA)
【課題】局所研磨加工による加工量が安定し、高い修正空間分解能を得ることも可能な、修正研磨加工に好適な局所研磨加工技術を提供せんとする。 【解決手段】 ワーク9に対して局所的に押し付けられるワーク研磨用の回転ツール11と前記ワーク9との間に、平均粒径5μm以上の有機粒子からなる砥粒81を液体中に分散させた研磨加工液を供給しながら、押し付け研磨加工を行う。回転ツール11は弾性素材より構成される。
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