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1. WO2020029363 - OLED DEVICE AND PREPARATION METHOD THEREFOR

Publication Number WO/2020/029363
Publication Date 13.02.2020
International Application No. PCT/CN2018/104970
International Filing Date 11.09.2018
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/32 (2006.01)
H01L 21/77 (2017.01)
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国湖北省武汉市 东湖新技术开发区高新大道666号光谷生物创新园C5栋305室 305 Room, Building C5, Biolake of Optics Valley, No.666 Gaoxin Avenue Wuhan East Lake High-tech Development Zone Wuhan, Hubei 430079, CN
Inventors
  • 王海 WANG, Hai; CN
  • 颜伟男 YAN, Weinan; CN
  • 蔡昆岳 TSAI, Kunyueh; CN
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY; 中国广东省深圳市 福田区深南大道6021号喜年中心A座1709-1711 Room 1709-1711 Block A, Hailrun Complex, No.6021 Shennan Blvd, Futian District Shenzhen, Guangdong 518040, CN
Priority Data
201810907178.210.08.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OLED DEVICE AND PREPARATION METHOD THEREFOR
(FR) DISPOSITIF À OLED ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种OLED器件及其制备方法
Abstract
(EN)
Provided are an OLED device and a preparation method therefor. The OLED device comprises: a flexible substrate (302), wherein a signal electrode (307) is embedded on the surface of one side of the flexible substrate (302) and a film transistor layer (303) and a pixel cell layer (304) are prepared on the surface of the other side of the flexible substrate (302); both a first drive chip (314) and a flexible circuit board (3016) are arranged on the back of the flexible substrate (302); and signal traces in the film transistor layer (303) and the pixel cell layer (304) are connected with a corresponding signal electrode (307) through via holes (308-311) respectively, and the signal electrode (307) is connected with the first drive chip (314).
(FR)
L'invention concerne un dispositif à OLED et son procédé de préparation. Le dispositif à OLED comprend : un substrat flexible (302), une électrode de signal (307) étant incorporée sur la surface d'un côté du substrat flexible (302) et une couche de transistor à couche (303) et une couche de cellule de pixel (304) sont préparées sur la surface de l'autre côté du substrat flexible (302); à la fois une première puce d'attaque (314) et une carte de circuit imprimé flexible (3016) sont disposées sur l'arrière du substrat flexible (302); et des traces de signal dans la couche de transistor à couche (303) et la couche de cellule de pixel (304) sont connectées à une électrode de signal correspondante (307) par l'intermédiaire de trous d'interconnexion (308-311) respectivement, et l'électrode de signal (307) est connectée à la première puce d'attaque (314).
(ZH)
提供一种OLED器件及其制备方法,包括:柔性基板(302),柔性基板(302)一侧表面嵌设有信号电极(307),另一侧表面制备有薄膜晶体管层(303)与像素单元层(304);第一驱动芯片(314)与柔性电路板(3016)均设置于柔性基板(302)的背面;薄膜晶体管层(303)以及像素单元层(304)中的信号走线分别通过过孔(308-311)与相应的信号电极(307)连接,信号电极(307)与第一驱动芯片(314)连接。
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